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Search results: 1 events

2027-02-17 - 2027-02-19

The 28th Semiconductor and Sensor Packaging Exhibition - Specialized Exhibition for Semiconductor Post-Processing (ISP)

A specialized exhibition focused on semiconductor post-processing, where technological innovations such as 2.5D/3D and chiplets are advancing.

Tokyo Big Sight

2.5D/3D Technology Chiplets Semiconductor Post-Processing Semiconductor Packaging Technology

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